GD74HCT377J vs 74HCT377PW feature comparison

GD74HCT377J Goldstar Electron Co Ltd

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74HCT377PW NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD NXP SEMICONDUCTORS
Package Description , TSSOP, TSSOP20,.25
Reach Compliance Code unknown compliant
Additional Feature WITH HOLD MODE WITH HOLD MODE
Family HCT HCT
JESD-30 Code R-CDIP-T20 R-PDSO-G20
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 32 ns 48 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 22 MHz 60 MHz
Base Number Matches 1 6
Pbfree Code Yes
Rohs Code Yes
Part Package Code TSSOP
Pin Count 20
HTS Code 8542.39.00.01
JESD-609 Code e4
Length 6.5 mm
Max Frequency@Nom-Sup 22000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP20,.25
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.1 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm

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