GS76024AB-12I vs WED8L24258V10BC feature comparison

GS76024AB-12I GSI Technology

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WED8L24258V10BC White Electronic Designs Corp

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GSI TECHNOLOGY WHITE ELECTRONIC DESIGNS CORP
Part Package Code BGA
Package Description BGA, 14 X 22 MM, MO-163, BGA-119
Pin Count 119
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Access Time-Max 12 ns 10 ns
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0
Length 22 mm 22 mm
Memory Density 6291456 bit 6291456 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 24 24
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 256KX24 256KX24
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 220 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.99 mm 2.794 mm
Supply Voltage-Max (Vsup) 3.6 V 3.465 V
Supply Voltage-Min (Vsup) 3 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 2 1
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA119,7X17,50
Standby Current-Max 0.09 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.5 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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