GS816132DD-375T vs GS816132DGD-333V feature comparison

GS816132DD-375T GSI Technology

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GS816132DGD-333V GSI Technology

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Part Life Cycle Code Active Active
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description LBGA, LBGA,
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 4.2 ns 5 ns
Additional Feature FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V ALSO OPERATES AT 2.5V
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 15 mm 15 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX32 512KX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 2.7 V 2 V
Supply Voltage-Min (Vsup) 2.3 V 1.7 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 1 1
Rohs Code Yes
Factory Lead Time 24 Weeks
Samacsys Manufacturer GSI TECHNOLOGY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare GS816132DD-375T with alternatives

Compare GS816132DGD-333V with alternatives