GS8182T18BD-200
vs
K7I161882B-FC20
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
No
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
LBGA,
LBGA, BGA165,11X15,40
Pin Count
165
165
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.B.2.B
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE, LATE WRITE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e0
e0
Length
15 mm
17 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
DDR II SRAM
DDR SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX18
1MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
15 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
BGA165,11X15,40
Standby Current-Max
0.16 A
Standby Voltage-Min
1.7 V
Supply Current-Max
0.4 mA
Compare GS8182T18BD-200 with alternatives
Compare K7I161882B-FC20 with alternatives