GS8182T19BD-435M vs IDT71V2548XS133PF feature comparison

GS8182T19BD-435M GSI Technology

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IDT71V2548XS133PF Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer GSI TECHNOLOGY INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA QFP
Package Description LBGA, LQFP,
Pin Count 165 100
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 0.45 ns 4.2 ns
Additional Feature PIPELINED ARCHITECTURE, LATE WRITE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PQFP-G100
Length 15 mm 20 mm
Memory Density 18874368 bit 4718592 bit
Memory IC Type DDR SRAM ZBT SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 165 100
Number of Words 1048576 words 262144 words
Number of Words Code 1000000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 1MX18 256KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.6 mm
Supply Voltage-Max (Vsup) 1.9 V 3.465 V
Supply Voltage-Min (Vsup) 1.7 V 3.135 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.65 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 13 mm 14 mm
Base Number Matches 2 2
Pbfree Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Terminal Finish Tin/Lead (Sn/Pb)

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