GS8182T19BD-435M vs R1Q3A3636ABG-33R feature comparison

GS8182T19BD-435M GSI Technology

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R1Q3A3636ABG-33R Renesas Electronics Corporation

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Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer GSI TECHNOLOGY RENESAS TECHNOLOGY CORP
Part Package Code BGA BGA
Package Description LBGA, 15 X 17 MM, 1 MM PITCH, PLASTIC, LBGA-165
Pin Count 165 165
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE, LATE WRITE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 15 mm 17 mm
Memory Density 18874368 bit 37748736 bit
Memory IC Type DDR SRAM QDR SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 1MX18 1MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.46 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm 15 mm
Base Number Matches 2 1
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER

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Compare R1Q3A3636ABG-33R with alternatives