GS8641E36GF-300T vs GS8640ZV36GT-167T feature comparison

GS8641E36GF-300T GSI Technology

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GS8640ZV36GT-167T GSI Technology

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA QFP
Package Description BGA, LQFP,
Pin Count 165 100
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 5.5 ns 8 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PQFP-G100
JESD-609 Code e1
Memory Density 75497472 bit 75497472 bit
Memory IC Type CACHE SRAM ZBT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 165 100
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX36 2MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 2.7 V 2 V
Supply Voltage-Min (Vsup) 2.3 V 1.6 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER PURE MATTE TIN
Terminal Form BALL GULL WING
Terminal Position BOTTOM QUAD
Base Number Matches 1 1
Length 20 mm
Seated Height-Max 1.6 mm
Terminal Pitch 0.65 mm
Width 14 mm

Compare GS8641E36GF-300T with alternatives

Compare GS8640ZV36GT-167T with alternatives