GS8672Q38BE-450T vs GS8662T38AGE-375T feature comparison

GS8672Q38BE-450T GSI Technology

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GS8662T38AGE-375T GSI Technology

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description LBGA, BGA165,11X15,40 LBGA,
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 450 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 15 mm 17 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type QDR SRAM DDR SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX36 2MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.5 mm
Standby Voltage-Min 1.7 V
Supply Current-Max 2.05 mA
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 15 mm
Base Number Matches 1 1
Pbfree Code Yes
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN SILVER COPPER

Compare GS8672Q38BE-450T with alternatives

Compare GS8662T38AGE-375T with alternatives