GXM-200B2.9V70C vs MPC8245LVV300D feature comparison

GXM-200B2.9V70C Texas Instruments

Buy Now Datasheet

MPC8245LVV300D NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code BGA
Package Description BGA, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352
Pin Count 352
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B352 S-PBGA-B352
Length 35 mm 35 mm
Low Power Mode YES YES
Number of Terminals 352 352
Operating Temperature-Max 70 °C 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.23 mm 1.65 mm
Speed 200 MHz 300 MHz
Supply Voltage-Max 3.05 V 2.1 V
Supply Voltage-Min 2.75 V 1.7 V
Supply Voltage-Nom 2.9 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 1 1
Rohs Code Yes
ECCN Code 3A991.A.2
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Clock Frequency-Max 66 MHz
JESD-609 Code e1
Moisture Sensitivity Level 3
Package Equivalence Code BGA352,26X26,50
Peak Reflow Temperature (Cel) 245
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) 30

Compare GXM-200B2.9V70C with alternatives

Compare MPC8245LVV300D with alternatives