GXM-200B2.9V70C
vs
PCX8240VTPU200C
feature comparison
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
|
| Part Package Code |
BGA
|
|
| Package Description |
BGA,
|
|
| Pin Count |
352
|
|
| Reach Compliance Code |
unknown
|
|
| HTS Code |
8542.31.00.01
|
|
| Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
|
| Address Bus Width |
32
|
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
|
| External Data Bus Width |
32
|
|
| Format |
FLOATING POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B352
|
|
| Length |
35 mm
|
|
| Low Power Mode |
YES
|
|
| Number of Terminals |
352
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
BGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.23 mm
|
|
| Speed |
200 MHz
|
|
| Supply Voltage-Max |
3.05 V
|
|
| Supply Voltage-Min |
2.75 V
|
|
| Supply Voltage-Nom |
2.9 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
35 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
|
| Base Number Matches |
1
|
|
|
|
|
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