H11AA1
vs
TLP630(GB-LF1)
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
TOSHIBA CORP
|
| Package Description |
PLASTIC, DIP-6
|
PLASTIC, DIP-6
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8541.40.80.00
|
8541.40.80.00
|
| Additional Feature |
UL RECOGNIZED
|
UL RECOGNIZED
|
| Coll-Emtr Bkdn Voltage-Min |
30 V
|
55 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Current Transfer Ratio-Min |
20%
|
|
| Current Transfer Ratio-Nom |
50%
|
100%
|
| Dark Current-Max |
100 nA
|
100 nA
|
| Forward Current-Max |
0.06 A
|
0.06 A
|
| Forward Voltage-Max |
1.5 V
|
|
| Isolation Voltage-Max |
7500 V
|
5000 V
|
| JESD-609 Code |
e0
|
e0
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
|
| Number of Elements |
1
|
1
|
| On-State Current-Max |
0.1 A
|
|
| Operating Temperature-Max |
100 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-25 °C
|
| Optoelectronic Device Type |
AC INPUT-TRANSISTOR OUTPUT OPTOCOUPLER
|
AC INPUT-TRANSISTOR OUTPUT OPTOCOUPLER
|
| Power Dissipation-Max |
0.25 W
|
|
| Response Time-Max |
0.000005 s
|
|
| Surface Mount |
NO
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Base Number Matches |
12
|
1
|
|
|
|
Compare H11AA1 with alternatives
Compare TLP630(GB-LF1) with alternatives