HC55185FCMZ96
vs
HC55171IB
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
| Part Package Code |
PLCC
|
SOIC
|
| Package Description |
LEAD FREE, PLASTIC, MS-018AB, LCC-28
|
SOIC-28
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Battery Feed |
CONSTANT CURRENT
|
RESISTIVE
|
| Hybrid |
2-4 CONVERSION
|
2-4 CONVERSION
|
| JESD-30 Code |
S-PQCC-J28
|
R-PDSO-G28
|
| JESD-609 Code |
e3
|
e0
|
| Length |
11.505 mm
|
17.9 mm
|
| Moisture Sensitivity Level |
3
|
|
| Noise-Max |
13 dBrnC
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
SOP
|
| Package Equivalence Code |
LDCC28,.5SQ
|
SOP28,.4
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
2.65 mm
|
| Supply Current-Max |
0.0135 mA
|
0.006 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Telecom IC Type |
SLIC
|
SLIC
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
11.505 mm
|
7.5 mm
|
| Base Number Matches |
1
|
1
|
| Battery Supply |
|
-24 V
|
| PSRR-Min |
|
33 dB
|
|
|
|
Compare HC55185FCMZ96 with alternatives
Compare HC55171IB with alternatives