HCF4016BEY
vs
HEF4066BDF
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
NXP SEMICONDUCTORS
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP, DIP14,.3
|
DIP,
|
Pin Count |
14
|
14
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
STMicroelectronics
|
|
Analog IC - Other Type |
SPST
|
SPST
|
JESD-30 Code |
R-PDIP-T14
|
R-GDIP-T14
|
JESD-609 Code |
e3
|
|
Neg Supply Voltage-Max (Vsup) |
-10 V
|
|
Neg Supply Voltage-Min (Vsup) |
-1.5 V
|
|
Neg Supply Voltage-Nom (Vsup) |
-5 V
|
|
Normal Position |
NO
|
|
Number of Channels |
1
|
1
|
Number of Functions |
4
|
4
|
Number of Terminals |
14
|
14
|
Off-state Isolation-Nom |
50 dB
|
50 dB
|
On-state Resistance Match-Nom |
15 Ω
|
5 Ω
|
On-state Resistance-Max (Ron) |
660 Ω
|
175 Ω
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output |
SEPARATE OUTPUT
|
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP14,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.1 mm
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
10 V
|
|
Supply Voltage-Min (Vsup) |
1.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
Surface Mount |
NO
|
NO
|
Switch-on Time-Max |
30 ns
|
30 ns
|
Technology |
MOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
Switch-off Time-Max |
|
140 ns
|
|
|
|
Compare HCF4016BEY with alternatives
Compare HEF4066BDF with alternatives