HCHP0603K10R0FB55
vs
RC1608F100GS
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
SAMSUNG ELECTRO-MECHANICS
|
| Package Description |
CHIP
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8533.21.00.30
|
|
| Additional Feature |
HIGH PRECISION
|
|
| Construction |
Rectangular
|
Chip
|
| Mounting Feature |
SURFACE MOUNT
|
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.53 mm
|
0.45 mm
|
| Package Length |
1.68 mm
|
1.6 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.98 mm
|
0.8 mm
|
| Packing Method |
WAFFLE PACK
|
Bulk
|
| Rated Power Dissipation (P) |
0.1 W
|
0.1 W
|
| Rated Temperature |
70 °C
|
|
| Resistance |
10 Ω
|
10 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
0603
|
0603
|
| Surface Mount |
YES
|
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Terminal Finish |
TIN LEAD SILVER OVER NICKEL
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
| Terminal Shape |
WRAPAROUND
|
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
50 V
|
50 V
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e3
|
|
|
|
Compare HCHP0603K10R0FB55 with alternatives
Compare RC1608F100GS with alternatives