HCPL-0701
vs
TLP550
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
BROADCOM INC
|
TOSHIBA CORP
|
| Package Description |
SOIC-8
|
11-10C4, DIP-8
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8541.40.80.00
|
|
| Factory Lead Time |
14 Weeks
|
|
| Samacsys Manufacturer |
Avago Technologies
|
Toshiba
|
| Additional Feature |
CMOS COMPATIBLE, UL RECOGNIZED
|
TTL COMPATIBLE, UL RECOGNIZED
|
| Configuration |
SINGLE
|
SINGLE
|
| Current Transfer Ratio-Min |
400%
|
|
| Data Rate-Nom |
0.1 MBps
|
|
| Forward Current-Max |
0.012 A
|
0.025 A
|
| Forward Voltage-Max |
1.7 V
|
|
| Isolation Voltage-Max |
3750 V
|
2500 V
|
| JESD-609 Code |
e0
|
|
| Mounting Feature |
SURFACE MOUNT
|
|
| Number of Elements |
1
|
1
|
| Number of Functions |
1
|
|
| On-State Current-Max |
0.06 A
|
0.008 A
|
| Operating Temperature-Max |
70 °C
|
100 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Optoelectronic Device Type |
LOGIC IC OUTPUT OPTOCOUPLER
|
LOGIC IC OUTPUT OPTOCOUPLER
|
| Power Dissipation-Max |
0.1 W
|
|
| Response Time-Max |
0.000025 s
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Surface Mount |
YES
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Base Number Matches |
10
|
20
|
|
|
|
Compare HCPL-0701 with alternatives
Compare TLP550 with alternatives