HCPL-2219
vs
HCPL-2200
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
AVAGO TECHNOLOGIES INC
|
HEWLETT PACKARD CO
|
| Package Description |
DIP-8
|
HERMETIC SEALED, DIP-8
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8541.40.80.00
|
8541.40.80.00
|
| Additional Feature |
CMOS COMPATIBLE, UL RECOGNIZED, TRI STATE
|
CMOS COMPATIBLE, TRI STATE , UL RECOGNIZED
|
| Configuration |
SINGLE
|
COMPLEX
|
| Data Rate-Nom |
2.5 MBps
|
2.5 MBps
|
| Forward Current-Max |
0.005 A
|
0.01 A
|
| Hysteresis Ratio-Nom |
0.02
|
0.02
|
| Isolation Voltage-Max |
3750 V
|
2500 V
|
| JESD-609 Code |
e0
|
e0
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
|
| Number of Elements |
1
|
1
|
| Number of Functions |
1
|
|
| On-State Current-Max |
0.025 A
|
0.025 A
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Optoelectronic Device Type |
LOGIC IC OUTPUT OPTOCOUPLER
|
LOGIC IC OUTPUT OPTOCOUPLER
|
| Power Dissipation-Max |
0.21 W
|
|
| Response Time-Nom |
5.5e-8 ns
|
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
20 V
|
|
| Surface Mount |
NO
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Base Number Matches |
15
|
5
|
|
|
|
Compare HCPL-2219 with alternatives
Compare HCPL-2200 with alternatives