HCPL-M456
vs
TLP750F
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
AVAGO TECHNOLOGIES INC
|
TOSHIBA CORP
|
| Package Description |
MO-155, SOIC-5
|
11-10C402, DIP-8
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8541.40.80.00
|
8541.40.80.00
|
| Samacsys Manufacturer |
Avago Technologies
|
|
| Additional Feature |
UL RECOGNIZED
|
UL RECOGNIZED
|
| Configuration |
SINGLE
|
SINGLE
|
| Forward Current-Max |
0.025 A
|
0.025 A
|
| Isolation Voltage-Max |
3750 V
|
5000 V
|
| JESD-609 Code |
e0
|
|
| Mounting Feature |
SURFACE MOUNT
|
THROUGH HOLE MOUNT
|
| Number of Elements |
1
|
1
|
| Number of Functions |
1
|
1
|
| On-State Current-Max |
0.015 A
|
0.008 A
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Optoelectronic Device Type |
LOGIC IC OUTPUT OPTOCOUPLER
|
LINEAR IC OUTPUT OPTOCOUPLER
|
| Packing Method |
TUBE
|
|
| Power Dissipation-Max |
0.1 W
|
0.1 W
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
30 V
|
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Base Number Matches |
8
|
5
|
| Current Transfer Ratio-Min |
|
5%
|
| Forward Voltage-Max |
|
1.85 V
|
|
|
|
Compare HCPL-M456 with alternatives
Compare TLP750F with alternatives