HCPL-M456
vs
HCPL0501R2V
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
HEWLETT PACKARD CO
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Package Description |
SOIC-8
|
SOP-8
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8541.40.80.00
|
8541.40.80.00
|
| Additional Feature |
UL RECOGNIZED
|
UL RECOGNIZED, VDE APPROVED, OPEN COLLECTOR OUTPUT
|
| Configuration |
SINGLE
|
SINGLE
|
| Forward Current-Max |
0.025 A
|
0.025 A
|
| Isolation Voltage-Max |
2500 V
|
2500 V
|
| JESD-609 Code |
e0
|
e3
|
| Number of Elements |
1
|
1
|
| On-State Current-Max |
0.015 A
|
0.008 A
|
| Operating Temperature-Max |
100 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Optoelectronic Device Type |
LOGIC IC OUTPUT OPTOCOUPLER
|
LOGIC IC OUTPUT OPTOCOUPLER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn)
|
| Base Number Matches |
4
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| Manufacturer Package Code |
|
8LD,SOIC,.150" BODY,OPTO,WHITE COPLANAR
|
| ECCN Code |
|
EAR99
|
| Current Transfer Ratio-Min |
|
15%
|
| Data Rate-Nom |
|
1 MBps
|
| Forward Voltage-Max |
|
1.7 V
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Number of Functions |
|
1
|
| Packing Method |
|
TR
|
| Power Dissipation-Max |
|
0.1 W
|
| Surface Mount |
|
YES
|
|
|
|
Compare HCPL-M456 with alternatives
Compare HCPL0501R2V with alternatives