HD3SS214IZXHR
vs
HD3SS214IZQER
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
NFBGA-50
|
VFBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
DIFFERENTIAL MULTIPLEXER
|
Input Voltage-Max |
1.8 V
|
|
Input Voltage-Min |
-1.8 V
|
|
JESD-30 Code |
S-PBGA-B50
|
S-PBGA-B50
|
JESD-609 Code |
e1
|
e1
|
Length |
5 mm
|
5 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Channels |
4
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
50
|
50
|
Off-state Isolation-Nom |
26 dB
|
|
On-state Resistance Match-Nom |
1.5 Ω
|
|
On-state Resistance-Max (Ron) |
12 Ω
|
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output |
COMMON OUTPUT
|
COMMON OUTPUT
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA50,9X9,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Current-Max (Isup) |
1 mA
|
5 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
5 mm
|
5 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Date Of Intro |
|
2016-04-02
|
Normal Position |
|
NO
|
|
|
|
Compare HD3SS214IZXHR with alternatives
Compare HD3SS214IZQER with alternatives