HD6301V1CG
vs
HD6301V1CG
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Contact Manufacturer
|
| Ihs Manufacturer |
HITACHI LTD
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
LCC
|
LCC
|
| Package Description |
QCCN, LCC40,.5SQ,40
|
HVQCCN,
|
| Pin Count |
40
|
40
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| CPU Family |
6800
|
|
| Clock Frequency-Max |
4 MHz
|
4 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-GQCC-N40
|
S-GQCC-N40
|
| JESD-609 Code |
e0
|
|
| Length |
12.19 mm
|
12.19 mm
|
| Number of I/O Lines |
29
|
29
|
| Number of Terminals |
40
|
40
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC40,.5SQ,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
128
|
|
| ROM (words) |
4096
|
|
| ROM Programmability |
MROM
|
MROM
|
| Seated Height-Max |
2.35 mm
|
2.35 mm
|
| Speed |
1 MHz
|
1 MHz
|
| Supply Current-Max |
10 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.02 mm
|
1.02 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
12.19 mm
|
12.19 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
|
|
|