HD6417604SFI28
vs
HD6417604SFI28
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
HITACHI LTD
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
FQFP,
|
FQFP,
|
| Pin Count |
144
|
144
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
27
|
27
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
8 MHz
|
8 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
| Length |
20 mm
|
20 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of External Interrupts |
16
|
16
|
| Number of Terminals |
144
|
144
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
FQFP
|
| Package Equivalence Code |
QFP144,.87SQ,20
|
QFP144,.87SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.05 mm
|
3.05 mm
|
| Speed |
28.7 MHz
|
28.7 MHz
|
| Supply Current-Max |
160 mA
|
160 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
20 mm
|
20 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare HD6417604SFI28 with alternatives
Compare HD6417604SFI28 with alternatives