HD6417750F167 vs 79RC32V332150DHI feature comparison

HD6417750F167 Renesas Electronics Corporation

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79RC32V332150DHI Integrated Device Technology Inc

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description QFP-208 FQFP, QFP208,1.2SQ,20
Pin Count 208 208
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks
Address Bus Width 26 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 34 MHz 75.18 MHz
External Data Bus Width 64 32
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PQFP-G208 S-PQFP-G208
Length 28 mm 28 mm
Low Power Mode YES YES
Number of Terminals 208 208
Operating Temperature-Max 75 °C 85 °C
Operating Temperature-Min -20 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP FQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Seated Height-Max 3.56 mm 4.1 mm
Speed 167 MHz 150 MHz
Supply Voltage-Max 2 V 3.465 V
Supply Voltage-Min 1.6 V 3.135 V
Supply Voltage-Nom 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 28 mm 28 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 4 2
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Package Equivalence Code QFP208,1.2SQ,20
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Supply Current-Max 700 mA
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

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Compare 79RC32V332150DHI with alternatives