HD6417751F167
vs
5962-0324601Q9X
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
ATMEL CORP
|
| Part Package Code |
HFQFP
|
DIE
|
| Package Description |
QFP-256
|
DIE,
|
| Pin Count |
256
|
|
| Manufacturer Package Code |
PRQP0256LA
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Address Bus Width |
26
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
34 MHz
|
30.3 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
S-PQFP-G256
|
X-XUUC-N
|
| JESD-609 Code |
e0
|
|
| Length |
28 mm
|
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
256
|
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
-20 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
FQFP
|
DIE
|
| Package Shape |
SQUARE
|
UNSPECIFIED
|
| Package Style |
FLATPACK, FINE PITCH
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Seated Height-Max |
3.95 mm
|
|
| Speed |
167 MHz
|
15 MHz
|
| Supply Voltage-Max |
2 V
|
3.45 V
|
| Supply Voltage-Min |
1.6 V
|
3.15 V
|
| Supply Voltage-Nom |
1.8 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
|
| Terminal Position |
QUAD
|
UPPER
|
| Width |
28 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
1
|
| Screening Level |
|
MIL-PRF-38535 Class Q
|
|
|
|
Compare HD6417751F167 with alternatives
Compare 5962-0324601Q9X with alternatives