HD6417751F167
vs
HD6417751RF240
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
HFQFP
|
QFP
|
| Package Description |
QFP-256
|
QFP-256
|
| Pin Count |
256
|
256
|
| Manufacturer Package Code |
PRQP0256LA
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Address Bus Width |
26
|
26
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
34 MHz
|
34 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PQFP-G256
|
S-PQFP-G256
|
| JESD-609 Code |
e0
|
e0
|
| Length |
28 mm
|
28 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
FQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.95 mm
|
3.95 mm
|
| Speed |
167 MHz
|
240 MHz
|
| Supply Voltage-Max |
2 V
|
1.6 V
|
| Supply Voltage-Min |
1.6 V
|
1.4 V
|
| Supply Voltage-Nom |
1.8 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
28 mm
|
28 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare HD6417751F167 with alternatives
Compare HD6417751RF240 with alternatives