HD6432215CXXXBR
vs
HD6432215CXXXBR
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
HITACHI LTD
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LFBGA, BGA112,11X11,32
|
10 X 10 MM, 0.80 MM PITCH, PLASTIC, LFBGA-112
|
Pin Count |
112
|
112
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
24
|
24
|
Bit Size |
16
|
16
|
Clock Frequency-Max |
16 MHz
|
16 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-PBGA-B112
|
S-PBGA-B112
|
Length |
10 mm
|
10 mm
|
Number of I/O Lines |
75
|
75
|
Number of Terminals |
112
|
112
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
75 °C
|
75 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA112,11X11,32
|
BGA112,11X11,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
8192
|
8192
|
ROM (words) |
262144
|
262144
|
ROM Programmability |
MROM
|
MROM
|
Seated Height-Max |
1.4 mm
|
1.4 mm
|
Speed |
16 MHz
|
16 MHz
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
2.7 V
|
3 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
10 mm
|
10 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
2
|
Manufacturer Package Code |
|
PLBG0112GA-A
|
Samacsys Manufacturer |
|
Renesas Electronics
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|