HD74HC4053P vs 933372950652 feature comparison

HD74HC4053P Renesas Electronics Corporation

Buy Now Datasheet

933372950652 NXP Semiconductors

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Part Package Code DIP SOIC
Package Description DIP, DIP16,.3 PLASTIC, SOT-109, SO-16
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SINGLE-ENDED MULTIPLEXER DIFFERENTIAL MULTIPLEXER
JESD-30 Code R-PDIP-T16 R-PDSO-G16
Length 19.2 mm 9.9 mm
Moisture Sensitivity Level 1 1
Number of Channels 6 4
Number of Functions 1 1
Number of Terminals 16 16
Off-state Isolation-Nom 50 dB 50 dB
On-state Resistance Match-Nom 13 Ω 5 Ω
On-state Resistance-Max (Ron) 180 Ω 175 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.06 mm 1.75 mm
Signal Current-Max 0.025 A
Supply Current-Max (Isup) 0.04 mA
Supply Voltage-Max (Vsup) 6 V 15 V
Supply Voltage-Min (Vsup) 2 V 3 V
Supply Voltage-Nom (Vsup) 4.5 V 15 V
Surface Mount NO YES
Switch-off Time-Max 30 ns 180 ns
Switch-on Time-Max 30 ns 85 ns
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 2 2
JESD-609 Code e4
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare HD74HC4053P with alternatives

Compare 933372950652 with alternatives