HD74HC595RP-EL
vs
MC74HC595ADR2
feature comparison
Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Part Package Code |
SOIC
|
|
Package Description |
SOP,
|
SOP, SOP16,.25
|
Pin Count |
16
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Family |
HC/UH
|
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
Length |
9.9 mm
|
|
Logic IC Type |
SERIAL IN PARALLEL OUT
|
|
Number of Terminals |
16
|
16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
|
Surface Mount |
YES
|
YES
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9 mm
|
|
Base Number Matches |
2
|
5
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Max Frequency@Nom-Sup |
|
20000000 Hz
|
Number of Bits |
|
8
|
Number of Functions |
|
1
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Equivalence Code |
|
SOP16,.25
|
Power Supplies |
|
2/6 V
|
Technology |
|
CMOS
|
Temperature Grade |
|
MILITARY
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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