HDC1008YPAR
vs
HDC1000YPAT
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
VFBGA,
|
DSBGA-8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
JESD-30 Code |
R-PBGA-B8
|
R-PBGA-B8
|
JESD-609 Code |
e1
|
e1
|
Length |
2.04 mm
|
2.04 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
0.675 mm
|
0.675 mm
|
Supply Voltage-Max (Vsup) |
5 V
|
5 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1.59 mm
|
1.59 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare HDC1008YPAR with alternatives
Compare HDC1000YPAT with alternatives