HEF4006BPN vs HEF4006BDF feature comparison

HEF4006BPN Philips Semiconductors

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HEF4006BDF NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description DIP, DIP14,.3 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-GDIP-T14
JESD-609 Code e0
Max Frequency@Nom-Sup 9000000 Hz
Number of Bits 5 5
Number of Functions 1 4
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Part Package Code DIP
Pin Count 14
Additional Feature SHARED CLOCK BETWEEN 4 SHIFT REGISTERS; TWO 4 BIT & TWO 5 BIT SHIFT REGISTERS
Count Direction RIGHT
Family 4000/14000/40000
Load Capacitance (CL) 50 pF
Logic IC Type SERIAL IN SERIAL OUT
Output Polarity TRUE
Propagation Delay (tpd) 180 ns
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Trigger Type NEGATIVE EDGE
Width 7.62 mm
fmax-Min 9 MHz

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