HEF4006BPN vs M38510/05701BCA feature comparison

HEF4006BPN Philips Semiconductors

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M38510/05701BCA Motorola Semiconductor Products

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS MOTOROLA INC
Package Description DIP, DIP14,.3 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-XDIP-T14
JESD-609 Code e0
Max Frequency@Nom-Sup 9000000 Hz
Number of Bits 5 5
Number of Functions 1 4
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 5
Count Direction RIGHT
Family 4000/14000/40000
Logic IC Type SERIAL IN SERIAL OUT
Output Polarity TRUE
Propagation Delay (tpd) 1200 ns
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 12.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Trigger Type NEGATIVE EDGE

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