Register or Sign In

HEF4013BU vs HEF4013BT,652 feature comparison

HEF4013BU NXP Semiconductors

Buy Now Datasheet

HEF4013BT,652 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code WAFER SOIC
Package Description , PLASTIC, SOT-108, SO-14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code X-XUUC-N R-PDSO-G14
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE SOP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Propagation Delay (tpd) 220 ns 220 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 20 MHz 7 MHz
Base Number Matches 2 2
Rohs Code Yes
Pin Count 14
Manufacturer Package Code SOT108-1
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
JESD-609 Code e4
Length 8.65 mm
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 7000000 Hz
Moisture Sensitivity Level 1
Number of Terminals 14
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Equivalence Code SOP14,.25
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 220 ns
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm
Logic » FF/Latches
Logic » FF/Latches

Compare HEF4013BU with alternatives

Compare HEF4013BT,652 with alternatives