HEF4016BDF vs HEF4066BDB feature comparison

HEF4016BDF NXP Semiconductors

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HEF4066BDB NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 5V NOMINAL ALSO AVAILABLE
Analog IC - Other Type SPST SPST
JESD-30 Code R-GDIP-T14 R-GDIP-T14
Neg Supply Voltage-Nom (Vsup)
Number of Channels 1 1
Number of Functions 4 4
Number of Terminals 14 14
Off-state Isolation-Nom 50 dB 50 dB
On-state Resistance Match-Nom 10 Ω 5 Ω
On-state Resistance-Max (Ron) 350 Ω 175 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Switch-off Time-Max 100 ns 140 ns
Switch-on Time-Max 30 ns 30 ns
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Supply Current-Max (Isup) 0.03 mA

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