HEF4016BDF vs TC4066BP feature comparison

HEF4016BDF NXP Semiconductors

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TC4066BP Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code DIP DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 5V NOMINAL ALSO AVAILABLE
Analog IC - Other Type SPST SPST
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Neg Supply Voltage-Nom (Vsup)
Number of Channels 1 1
Number of Functions 4 4
Number of Terminals 14 14
Off-state Isolation-Nom 50 dB
On-state Resistance Match-Nom 10 Ω 10 Ω
On-state Resistance-Max (Ron) 350 Ω 950 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.45 mm
Supply Voltage-Nom (Vsup) 15 V 5 V
Surface Mount NO NO
Switch-off Time-Max 100 ns
Switch-on Time-Max 30 ns 120 ns
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Samacsys Manufacturer Toshiba
Length 19.25 mm
Normal Position NO
Output SEPARATE OUTPUT
Package Equivalence Code DIP14,.3
Peak Reflow Temperature (Cel) 260
Supply Current-Max (Isup) 0.03 mA
Time@Peak Reflow Temperature-Max (s) 30

Compare HEF4016BDF with alternatives

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