HEF4016BP,652 vs MC14066BCP feature comparison

HEF4016BP,652 NXP Semiconductors

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MC14066BCP Motorola Mobility LLC

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Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code DIP DIP
Package Description PLASTIC, DIP-14 DIP, DIP14,.3
Pin Count 14 14
Manufacturer Package Code SOT27-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature 5V NOMINAL ALSO AVAILABLE
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e4 e0
Length 19.025 mm 18.86 mm
Neg Supply Voltage-Nom (Vsup)
Number of Channels 1 1
Number of Functions 4 4
Number of Terminals 14 14
Off-state Isolation-Nom 50 dB 50 dB
On-state Resistance Match-Nom 10 Ω 10 Ω
On-state Resistance-Max (Ron) 350 Ω 280 Ω
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 4.69 mm
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Switch-off Time-Max 100 ns 60 ns
Switch-on Time-Max 30 ns 30 ns
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 4
Normal Position NO
Output SEPARATE OUTPUT
Package Equivalence Code DIP14,.3
Supply Current-Max (Isup) 0.03 mA

Compare HEF4016BP,652 with alternatives

Compare MC14066BCP with alternatives