HEF4016BPB vs HEF4066BDF feature comparison

HEF4016BPB NXP Semiconductors

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HEF4066BDF NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDIP-T14 R-GDIP-T14
Length 19.025 mm
Neg Supply Voltage-Nom (Vsup)
Number of Channels 1 1
Number of Functions 4 4
Number of Terminals 14 14
Off-state Isolation-Nom 50 dB 50 dB
On-state Resistance Match-Nom 10 Ω 5 Ω
On-state Resistance-Max (Ron) 350 Ω 175 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 5.08 mm
Supply Current-Max (Isup) 0.03 mA
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Switch-off Time-Max 100 ns 140 ns
Switch-on Time-Max 30 ns 30 ns
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Part Package Code DIP
Pin Count 14

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Compare HEF4066BDF with alternatives