HEF4016BT,652
vs
CD4052BFMS
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
PLASTIC, SO-14
|
DIP,
|
| Pin Count |
14
|
|
| Manufacturer Package Code |
SOT108-1
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
5V NOMINAL ALSO AVAILABLE
|
|
| Analog IC - Other Type |
SPST
|
DIFFERENTIAL MULTIPLEXER
|
| JESD-30 Code |
R-PDSO-G14
|
R-GDIP-T16
|
| JESD-609 Code |
e4
|
e0
|
| Length |
8.65 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Channels |
1
|
4
|
| Number of Functions |
4
|
1
|
| Number of Terminals |
14
|
16
|
| Off-state Isolation-Nom |
50 dB
|
|
| On-state Resistance Match-Nom |
10 Ω
|
|
| On-state Resistance-Max (Ron) |
350 Ω
|
1050 Ω
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
5.08 mm
|
| Supply Voltage-Nom (Vsup) |
15 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Switch-off Time-Max |
100 ns
|
210 ns
|
| Switch-on Time-Max |
30 ns
|
320 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3.9 mm
|
7.62 mm
|
| Base Number Matches |
2
|
3
|
| Screening Level |
|
MIL-PRF-38535 Class V
|
|
|
|
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