HEF4031BDB
vs
CD4031BFX
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTERSIL CORP
|
Package Description |
DIP,
|
DIP, DIP16,.3
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
DELAYED BUFFERED CLOCK OUTPUT FOR CASCADING
|
|
Count Direction |
RIGHT
|
RIGHT
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
R-GDIP-T16
|
R-XDIP-T16
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
SERIAL IN SERIAL OUT
|
SERIAL IN SERIAL OUT
|
Number of Bits |
64
|
64
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Propagation Delay (tpd) |
380 ns
|
500 ns
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
5.08 mm
|
|
Supply Voltage-Max (Vsup) |
15 V
|
18 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
7.62 mm
|
|
fmax-Min |
2.5 MHz
|
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Max Frequency@Nom-Sup |
|
2000000 Hz
|
Package Equivalence Code |
|
DIP16,.3
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare HEF4031BDB with alternatives
Compare CD4031BFX with alternatives