HEF4035BDB vs HEF4035BPB feature comparison

HEF4035BDB NXP Semiconductors

Buy Now Datasheet

HEF4035BPB NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature J AND KBAR SERIAL INPUT J AND KBAR SERIAL INPUT
Count Direction RIGHT RIGHT
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-PDIP-T16
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type PARALLEL IN PARALLEL OUT PARALLEL IN PARALLEL OUT
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity CONFIGURABLE CONFIGURABLE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 340 ns 340 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.7 mm
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 5 MHz 5 MHz
Base Number Matches 1 1
Length 21.6 mm

Compare HEF4035BDB with alternatives

Compare HEF4035BPB with alternatives