HEF4046BDF
vs
CD74HC4046AME4
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
| Package Description |
DIP,
|
SOP, SOP16,.25
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
PHASE LOCKED LOOP
|
PHASE LOCKED LOOP
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDSO-G16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
15 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
2 V
|
| Surface Mount |
NO
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| JESD-609 Code |
|
e4
|
| Length |
|
9.9 mm
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
SOP16,.25
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Supply Voltage-Nom (Vsup) |
|
3 V
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare HEF4046BDF with alternatives
Compare CD74HC4046AME4 with alternatives