HEF4046BDF vs MC14046BCPG feature comparison

HEF4046BDF NXP Semiconductors

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MC14046BCPG onsemi

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ONSEMI
Package Description DIP, ROHS COMPLIANT, PLASTIC, DIP-16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PHASE LOCKED LOOP PHASE LOCKED LOOP
JESD-30 Code R-GDIP-T16 R-PDIP-T16
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.44 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Surface Mount NO NO
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 16
Samacsys Manufacturer onsemi
Additional Feature IT CAN ALSO OPERATE AT 10V OR 15V NOMINAL
JESD-609 Code e3
Length 19.175 mm
Moisture Sensitivity Level 1
Package Equivalence Code DIP16,.3
Peak Reflow Temperature (Cel) 260
Supply Voltage-Nom (Vsup) 5 V
Technology CMOS
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 40

Compare HEF4046BDF with alternatives

Compare MC14046BCPG with alternatives