HEF4046BDF vs MM74HC4046SJX feature comparison

HEF4046BDF NXP Semiconductors

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MM74HC4046SJX Rochester Electronics LLC

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Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Package Description DIP, SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PHASE LOCKED LOOP PHASE LOCKED LOOP
JESD-30 Code R-GDIP-T16 R-PDSO-G16
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 2.1 mm
Supply Voltage-Max (Vsup) 15 V 6 V
Supply Voltage-Min (Vsup) 3 V 2 V
Surface Mount NO YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.3 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 16
JESD-609 Code e3
Length 10.1 mm
Moisture Sensitivity Level 1
Supply Voltage-Nom (Vsup) 5 V
Technology CMOS
Terminal Finish MATTE TIN

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