HEF4050BPB vs GD4050B feature comparison

HEF4050BPB NXP Semiconductors

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GD4050B Goldstar Electron Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS GOLDSTAR ELECTRON CO LTD
Package Description DIP, ,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Additional Feature CMOS-TTL LEVEL TRANSLATOR CMOS-TTL LEVEL TRANSLATOR
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T16 R-PDIP-T16
Length 21.6 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUFFER BUFFER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 70 ns 95 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.7 mm
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 4

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