HEF4051BTS
vs
HEF4051BT-Q100
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
SSOP, SSOP16,.3
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-PDSO-G16
|
|
| JESD-609 Code |
e0
|
e4
|
| Number of Channels |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
16
|
|
| On-state Resistance-Max (Ron) |
2500 Ω
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SSOP
|
|
| Package Equivalence Code |
SSOP16,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
|
| Qualification Status |
Not Qualified
|
|
| Signal Current-Max |
0.01 A
|
|
| Supply Current-Max (Isup) |
0.6 mA
|
|
| Surface Mount |
YES
|
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.635 mm
|
|
| Terminal Position |
DUAL
|
|
| Base Number Matches |
3
|
2
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Screening Level |
|
AEC-Q100
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare HEF4051BT-Q100 with alternatives