HEF4086BDB vs HEF4086BP feature comparison

HEF4086BDB NXP Semiconductors

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HEF4086BP NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description DIP, DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature EXPANDABLE EXPANDABLE
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND-OR-INVERT GATE AND-OR-INVERT GATE
Number of Functions 1 1
Number of Inputs 8 8
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 180 ns 180 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.2 mm
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
Part Package Code DIP
Pin Count 14
Length 19.025 mm
Max I(ol) 0.00035999999999999997 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 180 ns
Schmitt Trigger NO

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