HEF4555BTD-T vs MC14555BDR2G feature comparison

HEF4555BTD-T NXP Semiconductors

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MC14555BDR2G onsemi

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ONSEMI
Part Package Code SOIC SOIC 16 LEAD
Package Description SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e3
Length 9.9 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 2-LINE TO 4-LINE DECODER 2-LINE TO 4-LINE DECODER
Max I(ol) 0.00035999999999999997 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 295 ns 440 ns
Propagation Delay (tpd) 230 ns 440 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish NICKEL PALLADIUM GOLD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 2 1
Pbfree Code Yes
Manufacturer Package Code 751B-05
Factory Lead Time 40 Weeks
Samacsys Manufacturer onsemi
Time@Peak Reflow Temperature-Max (s) 30

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Compare MC14555BDR2G with alternatives