HFA3-0001-5
vs
LMH6609MF
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
SOT-23
|
| Package Description |
PACKAGE-8
|
SOT-23, 5-PIN
|
| Pin Count |
8
|
5
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
100 µA
|
3 µA
|
| Common-mode Reject Ratio-Nom |
47 dB
|
75 dB
|
| Input Offset Voltage-Max |
30000 µV
|
2500 µV
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G5
|
| JESD-609 Code |
e0
|
e0
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
1
|
| Neg Supply Voltage Limit-Max |
-6 V
|
-6.6 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-3.3 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
5
|
| Operating Temperature-Max |
75 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
LSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Slew Rate-Nom |
875 V/us
|
800 V/us
|
| Supply Voltage Limit-Max |
6 V
|
6.6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Unity Gain BW-Nom |
350000
|
180000
|
| Base Number Matches |
3
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
|
5 µA
|
| Frequency Compensation |
|
YES
|
| Length |
|
2.92 mm
|
| Low-Bias |
|
NO
|
| Low-Offset |
|
NO
|
| Micropower |
|
NO
|
| Package Equivalence Code |
|
TSOP5/6,.11,37
|
| Packing Method |
|
RAIL
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.22 mm
|
| Slew Rate-Min |
|
1200 V/us
|
| Supply Current-Max |
|
8.5 mA
|
| Terminal Pitch |
|
0.95 mm
|
| Wideband |
|
YES
|
| Width |
|
1.6 mm
|
|
|
|
Compare HFA3-0001-5 with alternatives
Compare LMH6609MF with alternatives