HI1-0303-2 vs DG300ABK feature comparison

HI1-0303-2 Rochester Electronics LLC

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DG300ABK Temic Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC TEMIC SEMICONDUCTORS
Part Package Code DIP
Package Description DIP,
Pin Count 14
Reach Compliance Code unknown unknown
Analog IC - Other Type SPDT SPST
JESD-30 Code R-GDIP-T14 R-GDIP-T14
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Channels 1 1
Number of Functions 2 2
Number of Terminals 14 14
Off-state Isolation-Nom 60 dB 62 dB
On-state Resistance-Max (Ron) 50 Ω 50 Ω
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -25 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Switch-off Time-Max 250 ns
Switch-on Time-Max 300 ns
Technology CMOS CMOS
Temperature Grade MILITARY OTHER
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 6 7
Qualification Status Not Qualified
Supply Current-Max (Isup) 1 mA

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