HI1-0508/883
vs
ISL84522IBZ
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
INTERSIL CORP
|
| Package Description |
,
|
SOP,
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SPST
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDSO-G16
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-5 V
|
| Number of Channels |
8
|
1
|
| Number of Functions |
1
|
4
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
68 dB
|
|
| On-state Resistance Match-Nom |
9 Ω
|
1 Ω
|
| On-state Resistance-Max (Ron) |
300 Ω
|
100 Ω
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
15 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Switch-off Time-Max |
500 ns
|
30 ns
|
| Switch-on Time-Max |
500 ns
|
80 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
5
|
2
|
| Part Package Code |
|
SOIC, TSSOP
|
| Pin Count |
|
16, 16
|
| Factory Lead Time |
|
26 Weeks
|
| JESD-609 Code |
|
e3
|
| Length |
|
9.9 mm
|
| Moisture Sensitivity Level |
|
3
|
| Neg Supply Voltage-Max (Vsup) |
|
-6 V
|
| Neg Supply Voltage-Min (Vsup) |
|
-2 V
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
|
6 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Terminal Finish |
|
Matte Tin (Sn) - annealed
|
| Terminal Pitch |
|
1.27 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
3.9 mm
|
|
|
|
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