HI1-201-2
vs
ADG508FBRN-REEL7
feature comparison
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
ROCHESTER ELECTRONICS LLC
|
| Package Description |
,
|
SOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDSO-G16
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Channels |
1
|
8
|
| Number of Functions |
4
|
1
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
80 dB
|
93 dB
|
| On-state Resistance-Max (Ron) |
70 Ω
|
390 Ω
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
YES
|
| Switch-off Time-Max |
500 ns
|
150 ns
|
| Switch-on Time-Max |
500 ns
|
300 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| Additional Feature |
|
ACTIVE OVERVOLTAGE PROTECTION
|
| JESD-609 Code |
|
e0
|
| Length |
|
9.9 mm
|
| Moisture Sensitivity Level |
|
1
|
| Neg Supply Voltage-Max (Vsup) |
|
-16.5 V
|
| Neg Supply Voltage-Min (Vsup) |
|
-13.5 V
|
| On-state Resistance Match-Nom |
|
8.1 Ω
|
| Seated Height-Max |
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
|
16.5 V
|
| Supply Voltage-Min (Vsup) |
|
13.5 V
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
3.9 mm
|
|
|
|
Compare HI1-201-2 with alternatives
Compare ADG508FBRN-REEL7 with alternatives