HI3-0303-5Z
vs
DG303AAK
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2020-06-12
|
|
JESD-609 Code |
e3
|
e0
|
Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
Base Number Matches |
4
|
8
|
Pbfree Code |
|
No
|
Part Package Code |
|
DIP
|
Package Description |
|
DIP, DIP14,.3
|
Pin Count |
|
14
|
ECCN Code |
|
EAR99
|
Analog IC - Other Type |
|
SPDT
|
JESD-30 Code |
|
R-GDIP-T14
|
Length |
|
19.43 mm
|
Moisture Sensitivity Level |
|
1
|
Neg Supply Voltage-Max (Vsup) |
|
-18 V
|
Neg Supply Voltage-Min (Vsup) |
|
-5 V
|
Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
Number of Channels |
|
2
|
Number of Functions |
|
2
|
Number of Terminals |
|
14
|
Off-state Isolation-Nom |
|
62 dB
|
On-state Resistance-Max (Ron) |
|
50 Ω
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Output |
|
SEPARATE OUTPUT
|
Package Body Material |
|
CERAMIC, GLASS-SEALED
|
Package Code |
|
DIP
|
Package Equivalence Code |
|
DIP14,.3
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
|
240
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
|
18 V
|
Supply Voltage-Min (Vsup) |
|
5 V
|
Supply Voltage-Nom (Vsup) |
|
15 V
|
Surface Mount |
|
NO
|
Switch-off Time-Max |
|
250 ns
|
Switch-on Time-Max |
|
300 ns
|
Switching |
|
BREAK-BEFORE-MAKE
|
Technology |
|
CMOS
|
Temperature Grade |
|
MILITARY
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
Width |
|
7.62 mm
|
|
|
|
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